Materials for Assembly
Chip type will depend on desired application. Pictured are single slot, nanoporous membranes (NPSN100-1L, nanoporous silicon nitride 100 nm thick – 1 window; aka “NPN”)
Chip Tweezers: Techni-Tool SMD Handling Tweezer Double Angle SM111SA (Techni-Tool Part #: 758TW003)
Straight Tweezers: Techni-Tool Tweezer Stainless Steel Precision Type GG (Techni-Tool Part #: 758TW534)
CytoVU: SiMPore (Product Number CV-Slide)
Foam mat for setting down chip (can be purchased at any craft store or Amazon, eg. OLFA 9880 RM-CG 12-Inch x 18-Inch Self-Healing Double-Sided Rotary Mat – must be compliant and can be kept particle-free)
How to Flip a Chip (video showing how to flip a chip, note you need a soft surface such as a foam mat)
Bottom Channel Orientation
Trench-Up vs Trench-Down
The orientation of the chip in your device will depend on your application. For example, trench-down devices are useful if you desire a completely flat monolayer of cells and want to avoid changes in geometry. Trench-up devices are crucial for those using high resolution imaging and need to minimize working distance of cells and the objective.
When assembling your device, you place the chip in the OPPOSITE orientation than the desired final orientation, as shown in Video of Assembly Part 1.