ALine Modular Device Assembly

Materials for Assembly

Chip type will depend on desired application. Pictured are single slot, nanoporous membranes (NPSN100-1L, nanoporous silicon nitride 100 nm thick – 1 window; aka “NPN”)

Chip Tweezers: Techni-Tool SMD Handling Tweezer Double Angle SM111SA (Techni-Tool Part #: 758TW003)

Use for handling chips. These specific tweezers are highly recommended.

Notches help grip chip without slipping.







Straight Tweezers: Techni-Tool Tweezer Stainless Steel Precision Type GG (Techni-Tool Part #: 758TW534)

Use for removing protective layers from components. These can be replaced with other tweezers on hand.

CytoVU: SiMPore (Product Number CV-Slide)

Use to hold devices during imaging.

Foam mat for setting down chip (can be purchased at any craft store or Amazon, eg. OLFA 9880 RM-CG 12-Inch x 18-Inch Self-Healing Double-Sided Rotary Mat – must be compliant and can be kept particle-free)

Assembly Tutorials

Step-by-Step Assembly Instructions

Video of Assembly Part 1; Video of Assembly Part 2 (videos show assembly of trench-down device, note chip is placed trench-up on fixture A1)

How to Flip a Chip (video showing how to flip a chip, note you need a soft surface such as a foam mat)

Bottom Channel Orientation

Trench-Up vs Trench-Down

Trench-Down Device

Trench-Up Device

The orientation of the chip in your device will depend on your application. For example, trench-down devices are useful if you desire a completely flat monolayer of cells and want to avoid changes in geometry. Trench-up devices are crucial for those using high resolution imaging and need to minimize working distance of cells and the objective.

When assembling your device, you place the chip in the OPPOSITE orientation than the desired final orientation, as shown in Video of Assembly Part 1.

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