A while ago I made a post about the permeability through the 100K microcons in the wet-wet EQ format. I had run three membranes, and stopped (and restarted) the centrifugation at three separate time points to be able to calculate…

I tested ozone treatment influence on the membrane strength and air permeability. The result: didn’t see any difference between ozone treated and non-treated samples. Burst pressure experiments description: tried wafers 391, 393, 344, and 345. Ozone treatment for 5 and…

Above video shows the disruption of the membrane from W404 after around 12 hours in the DMEM media (benchtop). The membrane was not treated with UV-Ozone and degraded pretty early as compared to that from W336 which broke at ~28…

Maryna told me the UV/ozone cleaner did not work (the blue light in front of the chamber did not light up) when she was working with Dave today. I quickly checked the machine and it is actually working properly. The…

UPDATE:Chris took the membrane sample and normalized with by the no spanning membrane sample. This was plotted against the theoretical spectrum of single crystal silicon. The curves have a similar shape, but the single crystal silicon has lower transmission. This…

I treated samples from w312 using our ozone equipment. Quickly, here was the protocol:Place samples in chamberTurn on O2 and supplemental Ozone generatorAfter 3 mins, turn on Lamp in main chamber for 5 mins (Heater set to 110C)Leave samples in…

Here are images of actin filaments on Formvar coated 200 mesh nickel grid. Actin filaments were polymerized exactly as before. TEM sample preparation procedure is: 1. add actin solution on Formvar grid and wait 90 sec 2. remove liquid, add…

Last week I attempted to use the ozone cleaner and RTP to grow an oxide on bare 4″ wafers. I used the spectroscopic ellipsometer to measure the film thickness. I found that ~4 min. in the RTP @ 1150 C…

Production this week yielded mixed results. We ran eight wafers through four different RTP temperatures with/without the susceptor. We wanted to test our theory that temperature non-uniformity inside the chamber was causing the morphology change across the wafer. This proved…

Last week I reported wafer 403 showed uniformity across all positions but had a huge amount of pinholes. Wafer 404 (TEOS process & thermal oxide base) was initially annealed at 1000 C and then annealed again at 1000 C for…