Tag: mechanics

W648: Burst Pressure and the Return of Contamination?

We received W648 from the production team this week. Upon inspection of this wafer, is has a higher density of pinholes than we have been seeing lately (>3 pinholes/slit compared to 0 or 1/slit) and seems to show a return

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W613: Mechanical Testing

W613, the wafer with 30 nm thick pnc-Si that is oddly etched to form “H” shaped membranes, was tested for burst pressure and attempted to measure air permeability. When doing air permeability all samples broke, meaning are very weak. This

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W620: Mechanical Testing

The production crew recently delivered W620 to the lab, which was created to mimic W504 (and W612). W620 shows high burst pressure and has air permeability comparable to W504/612.

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W612 Characterization

I tested W612 for air permeability and burst pressure, shown below. It should be noted that the air permeability and burst pressure values are comparable to W504; looks like a good reproduction! I also tested a sample with the hexane

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Membrane Anneal Study: W510X, W600 Testing

I recently tested W510X and W600 described by Dave here for air permeability, rhodamine diffusion, and burst pressure. No air permeability was observed; even a sample with one very small pinhole (W600 800C anneal) only had a permeability of 11

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W509X Burst Pressure and Air Permeability

W509X, with single 100um by 1000um slits, was tested for air permeability and burst pressure. Prior to testing, I inspected all membranes for pinholes.; every sample had pinholes on the membrane perimeter, as shown below. The first two images are

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